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TT Electronics, a global provider of engineered electronics for performance critical applications, announced it has been awarded a contract from BAE Systems for the design, development and qualification of a DC-DC Converter to support project Tempest. Harnessing TT’s extensive engineering capabilities, this unit will be used within the Flight Control System (FCS) to deliver power conversion functionality to a number of elements within the FCS.
Team Tempest is composed of industry partners including BAE Systems, Rolls Royce, Leonardo and MBDA, and is tasked with delivering world firsts in advanced technical capabilities. Along with the RAF's Rapid Capabilities Office and the UK Ministry of Defence, this industry group is working to introduce the Tempest combat aircraft into service by 2035, replacing the existing Typhoon.
"BAE Systems are one of the most recognised names in the global defence industry and play a leading role in many of the world's most advanced military platforms,” said Ben Fox, Business Development Director, Power Solutions, TT Electronics. “Our initial project is to supply the company’s facility in Warton in support of Team Tempest. This exciting collaboration with BAE Systems provides an excellent opportunity to support our fellow industry partners, proudly working to revolutionise the development of combat air systems.”
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.