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Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the Sawa SC-BM500E Automatic Ultrasonic Stencil and Screen Cleaner. The system is specifically designed for high-density SMT applications.
The Sawa SC-BM500E offers precise cleaning with an ultrasonic Cleaning head designed for a variety of applications, including wafer bump and electroform stencils.
It accommodates a wide range of stencils from 320mm×320mm to 1000×740mm, and is ideal for customers using multiple types of stencils and screens.
The SC-BM500E is available in three models to accommodate specific customer needs and is capable of cleaning inks, adhesives and solder paste from fine pitch apertures.