Reading time ( words)
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the Sawa SC-BM500E Automatic Ultrasonic Stencil and Screen Cleaner. The system is specifically designed for high-density SMT applications.
The Sawa SC-BM500E offers precise cleaning with an ultrasonic Cleaning head designed for a variety of applications, including wafer bump and electroform stencils.
It accommodates a wide range of stencils from 320mm×320mm to 1000×740mm, and is ideal for customers using multiple types of stencils and screens.
The SC-BM500E is available in three models to accommodate specific customer needs and is capable of cleaning inks, adhesives and solder paste from fine pitch apertures.
Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.
Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.
Nolan Johnson, I-Connect007
Nolan Johnson recently spoke with Tuan Tran, director of customer solutions at Green Circuits, about what makes a successful process engineer. They also discuss a typical day in the life of a process engineer—from pre-manufacturing through post-DFM, for process improvement. As Tuan points out, there are a variety of paths to becoming a great process engineer.