Additive Electronics TechXchange Keynote Announced

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The SMTA announced Jeff Doubrava, Managing Partner, Prismark Partners LLC, will keynote the Additive Electronics Conference on October 15, 2020.

Mr. Doubrava will present “Outlook for Advanced Printed Circuit Board Fabrication - Applications, Technologies and Production” in which he will discuss the applications driving the fabrication of advanced PCB designs and provide current and mid-term views of the production of new designs and fabrication technologies.

Jeff Doubrava is a Managing Partner of Prismark Partners LLC, a 25-person consulting firm active at all levels of the electronics industry. At Prismark, Jeff works with a wide range of companies in areas such as electronic materials, intellectual property assessment, acquisition strategy development, and alternative energy. Prior to joining Prismark, Jeff spent twenty years with Shipley/Rohm and Haas, most recently as Global Business Director for the Printed Wiring Board Materials business.  Jeff holds a BA in Chemistry from the University of Rochester and an MBA from Babson College.  He holds several US patents for his development of enabling electronic materials.

The Additive Electronics Conference examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.

“We anticipate a lot of discussion again between attendees and presenters to gain the understanding of all supporting and utilizing this portion of the electronics supply chain,” noted conference co-chair, Lenora Clark. “Last year we learned of multiple different options for creating the circuit on various materials, this year we expect to dive deeper into market trends, usage and where additive fit within low, medium and high-volume production.”

Co-chair Tara Dunn noted, “We are excited to hear from industry experts including academia, telecommunications, US Department of Defense, major OEMs, global suppliers and leading consulting firms to put a more definitive shape to this emerging market segment.  We will investigate this portion of manufacture where the electronics industry straddles the line between PCB and IC substrate.”

Registration is open and sponsorship opportunities are available. For full details and to register, visit



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