MAGNALYTIX to Present Three Papers During SMTAI Virtual Conference

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MAGNALYTIX®, providing real-time reliability solutions for electronics manufacturing, announced its participation in the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 where you will have access to chat live with a MAGNALYTIX team member; the On-Demand Conference & Expo will take place Sept. 28-Oct 23, 2020. The MAGNALYTIX team will present three papers during the On-Demand Conference.

The first presentation will discuss IPC J-STD –001G, Amendment 1 that requires the assembler have a sampling plan to assure that the process remains in control once qualified and validated. It is well documented that electrochemical failures occur at component sites where flux residues are not fully activated. Also, it is well-known that specific components have a higher risk of electrochemical failure. Selecting a control plan that monitors the process and its performance on challenging components provides assurance that the process maintains control once established during process qualification.

The second presentation will address how the activity of flux residue changes, when trapped under low profile leadless or bottom terminated components. There are three factors to consider: 1. Standoff gap – Lower standoff gaps block outgassing channels. Low standoff gaps change the nature of the flux residue by leaving behind flux activators, solvents, and functional additives that normally would be outgassed from the residue. 2. Narrow Pitch – Miniaturized components have a decreased distance between conductors of opposite polarity. There is a higher potential to bridge conductors with flux residue. 3. Cubic Volume of Flux – Increased I/O in combination with thermal lugs creates a higher cubic volume of flux left under the bottom termination. High flux volumes can block outgassing channels and bridge conductors.

Finally, during the third presentation, MAGNALYTICS will discuss how the industry is moving toward leadless components with near chip-scale packages. The fastest-growing package types include leadless, passives, and a proliferation of new package styles that are larger with a higher number of connections. The advantages of these small components are well documented; however, concerns arise from the small overall dimensions, reliability, and manufacturability. Users must carefully select and validate whether these components are suitable for their intended use environments and customer applications. Soldering and cleanliness issues have been causal factors for many failures seen both in production and the field.



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