MAGNALYTIX to Present Three Papers During SMTAI Virtual Conference


Reading time ( words)

MAGNALYTIX®, providing real-time reliability solutions for electronics manufacturing, announced its participation in the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 where you will have access to chat live with a MAGNALYTIX team member; the On-Demand Conference & Expo will take place Sept. 28-Oct 23, 2020. The MAGNALYTIX team will present three papers during the On-Demand Conference.

The first presentation will discuss IPC J-STD –001G, Amendment 1 that requires the assembler have a sampling plan to assure that the process remains in control once qualified and validated. It is well documented that electrochemical failures occur at component sites where flux residues are not fully activated. Also, it is well-known that specific components have a higher risk of electrochemical failure. Selecting a control plan that monitors the process and its performance on challenging components provides assurance that the process maintains control once established during process qualification.

The second presentation will address how the activity of flux residue changes, when trapped under low profile leadless or bottom terminated components. There are three factors to consider: 1. Standoff gap – Lower standoff gaps block outgassing channels. Low standoff gaps change the nature of the flux residue by leaving behind flux activators, solvents, and functional additives that normally would be outgassed from the residue. 2. Narrow Pitch – Miniaturized components have a decreased distance between conductors of opposite polarity. There is a higher potential to bridge conductors with flux residue. 3. Cubic Volume of Flux – Increased I/O in combination with thermal lugs creates a higher cubic volume of flux left under the bottom termination. High flux volumes can block outgassing channels and bridge conductors.

Finally, during the third presentation, MAGNALYTICS will discuss how the industry is moving toward leadless components with near chip-scale packages. The fastest-growing package types include leadless, passives, and a proliferation of new package styles that are larger with a higher number of connections. The advantages of these small components are well documented; however, concerns arise from the small overall dimensions, reliability, and manufacturability. Users must carefully select and validate whether these components are suitable for their intended use environments and customer applications. Soldering and cleanliness issues have been causal factors for many failures seen both in production and the field.

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

IPC Standards Development: Business Challenges and an Inside View

10/28/2020 | Graham Naisbitt, Gen3 Systems
With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.

How to Benefit From Robotic Soldering Processes

10/28/2020 | Pete Starkey, I-Connect007
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.



Copyright © 2020 I-Connect007. All rights reserved.