MAGNALYTIX to Present Three Papers During SMTAI Virtual Conference

Reading time ( words)

MAGNALYTIX®, providing real-time reliability solutions for electronics manufacturing, announced its participation in the SMTA International Virtual Conference & Expo. The Live Virtual Exposition is scheduled to take place Sept. 28-30, 2020 where you will have access to chat live with a MAGNALYTIX team member; the On-Demand Conference & Expo will take place Sept. 28-Oct 23, 2020. The MAGNALYTIX team will present three papers during the On-Demand Conference.

The first presentation will discuss IPC J-STD –001G, Amendment 1 that requires the assembler have a sampling plan to assure that the process remains in control once qualified and validated. It is well documented that electrochemical failures occur at component sites where flux residues are not fully activated. Also, it is well-known that specific components have a higher risk of electrochemical failure. Selecting a control plan that monitors the process and its performance on challenging components provides assurance that the process maintains control once established during process qualification.

The second presentation will address how the activity of flux residue changes, when trapped under low profile leadless or bottom terminated components. There are three factors to consider: 1. Standoff gap – Lower standoff gaps block outgassing channels. Low standoff gaps change the nature of the flux residue by leaving behind flux activators, solvents, and functional additives that normally would be outgassed from the residue. 2. Narrow Pitch – Miniaturized components have a decreased distance between conductors of opposite polarity. There is a higher potential to bridge conductors with flux residue. 3. Cubic Volume of Flux – Increased I/O in combination with thermal lugs creates a higher cubic volume of flux left under the bottom termination. High flux volumes can block outgassing channels and bridge conductors.

Finally, during the third presentation, MAGNALYTICS will discuss how the industry is moving toward leadless components with near chip-scale packages. The fastest-growing package types include leadless, passives, and a proliferation of new package styles that are larger with a higher number of connections. The advantages of these small components are well documented; however, concerns arise from the small overall dimensions, reliability, and manufacturability. Users must carefully select and validate whether these components are suitable for their intended use environments and customer applications. Soldering and cleanliness issues have been causal factors for many failures seen both in production and the field.



Suggested Items

This Month in SMT007 Magazine: Robustness Is Not the Same as Reliability

09/02/2020 | I-Connect007 Editorial Team
Bob Neves discusses a disconnect he sees in reliability testing between what’s being tested and what happens out in the field, as well as why most reliability tests these days should instead be considered robustness tests.

Just Ask Joe: The Occam Process

08/25/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

MTV Offers Solder Paste Testing Solution

06/17/2020 | Nolan Johnson, I-Connect007
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.

Copyright © 2020 I-Connect007. All rights reserved.