Mycronic Receives Order for MYPro Line Solution for Flexible Electronics Manufacturing


Reading time ( words)

Mycronic, the leading Swedish high-tech company providing production equipment to the electronics industry, has received an order for a complete MYPro Line solution comprising two fully automated and complete assembly lines including intelligent component storage and software tools for process monitoring. Flexibility, process control, high productivity and superior production quality have been key factors in choosing Mycronic as a supplier. The net value of the order amount to approximately USD 3 million and is expected to be installed at customer site end of 2020.

Mycronic’s MYPro Line solution is receiving high interest from customers. The solution is a complete SMT assembly line, designed for smart factory connectivity. The order comprises of state-of-the-art jet printing technology, versatile pick-and-place equipment, high-accuracy 3D inspection systems, intelligent storage solutions and software tools for process control. With the MYPro Line, customers can achieve a more flexible and profitable electronics production.

“We are very proud that customers value our technology and invest in our full-line solutions. It demonstrates that we are creating production solutions that the market is looking for, and help our customers to improve profitability and expand their business,” says Clemens Jargon, Acting Sr VP Assembly Solutions High Flex at Mycronic.

Mycronic’s MYPro Line - one intelligent SMT line from a single vendor
With one integrated line from a single vendor, manufacturers benefit from continuous process improvement, real-time production insights and proactive component replenishment.

The MYPro Line offering comprises the following key technologies and process steps:

  • MY700 Jet Printer and Jet Dispenser – high-speed and high-precision jetting of solder paste and assembly fluids
  • PI 3D SPI – high-accuracy solder paste inspection of printed circuit boards
  • MY300 pick-and-place – versatile assembly equipment offering full flexibility from batch-size-one to series production
  • K 3D AOI – advanced automated optical inspection of printed circuit boards
  • SMD Tower – intelligent and compact component storage systems
  • Mycronic’s Assembly Process Management software suite - tailored software tools for process control of the most complex manufacturing environments

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in France, Japan, China, the Netherlands, Singapore, the United Kingdom, South Korea, Germany and the USA. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com 

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.