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MIRTEC, a “Leading Global Supplier” of Technologically Advanced Automated Inspection Systems to the Electronics Manufacturing Industry, is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
“ECA, Inc. is a full-service EMS provider to leading companies in the Aerospace, Military & Defense, Medical, and Industrial Applications Industries. ECA offers a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly. Quality and Service are the key factors to our success. We are a certified ISO 9001 and 13485 company with a documented quality management system, and we insist on continuous improvement. Our MIRTEC MV-3L Desktop AOI system has enabled us to significantly improve our production quality as well as the efficiency of our entire inspection process. MIRTEC’s Technical Support team has been outstanding in providing us with the crucial support necessary for our success. I can honestly say that purchasing a MIRTEC AOI machine is one of the best decisions we have ever made.” Akbal Grewal – Owner and CEO.
“It is truly an honor to be selected by ECA as their AOI Partner,” said Brian D’Amico, President of MIRTEC Corp. “We at MIRTEC are committed to continuous improvement through innovation and strong quality leadership. Ours is a business of precision and accuracy, reproducibility and specificity, timeliness and trust. These are the real products and services which we provide to our valued customers. We look forward to our continued partnership and the mutual success of our two organizations.”
MIRTEC’s Award-Winning MV-3L Desktop 3D AOI Machine is regarded as the industry’s most widely accepted Five Camera Desktop AOI system. This system is configured with an Ultra-High resolution 10 Mega Pixel Top-Down Camera System combined with a Precision Telecentric Compound Lens to provide precision inspection of SMT devices on finished PCB assemblies. Fully configured the MV-3L machines feature four (4) 10 Mega Pixel Side-View Cameras as well as MIRTEC’s exclusive INTELLI-BEAM® Laser System. This advanced technology provides four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability. The system is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.