-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Corporation Announces Low-Temp Solder Seminar at LEAP Expo
October 13, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Anson Yu, Technical Manager for Global Accounts in Asia, will present at the LEAP Expo, November 3-5 in Shenzhen, China.
Low-temperature soldering is not a “one alloy fits all” solution. Depending on the application, the actual temperature required for low-temperature soldering can vary widely. In Low-Temperature Solder Innovation—Durafuse™ LT and the Low- to Mid-Temperature Space, Yu will examine Durafuse’s ability to bring mid-temperature drop shock properties into the upper edge of the low-temperature space, as well as low-temperature solder’s specific process limitations and lifetime requirements.
Yu is the Technical Manager for Global Accounts in Asia and is based at Indium Corporation’s Suzhou facility. He is responsible for coordinating and managing technical service and resources to multinational accounts in Asia. He also assists with new business development, new product development, and technical resolutions. Yu has more than 10 years of manufacturing and equipment engineering experience. Prior to joining Indium Corporation, he was an Operations Engineering Manager, overseeing profit and loss indicators, process engineering, and equipment engineering. Yu earned his bachelor’s degree in electrical engineering from Nanjing Institute of Technology and his master of business administration from Wuhan University.
LEAP Expo—co-organized by Messe Muenchen Shanghai Co., Ltd., Chinese Optical Society-Laser Processing Committee, and China Machine Vision Industry Union—is comprised of five exhibitions: Automation & Robotics, productronica South China, South China Advanced Laser Technology and Application Exhibition, electronica South China, and VisionChina (Shenzhen).
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com.
Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.