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We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question.
Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.
We hope you enjoy “Just Ask Paul.”
Q: Where is the automotive segment moving as far as adopting generation three lead-free solders?
A: The expanded use of electronics in more sophisticated automotive applications, ranging from advanced safety to powertrain, has led to the continual adoption of high-reliability solder alloys. These multi-part alloys leverage traditional and non-traditional metallurgical techniques to create complex microstructures that enhance creep resistance at higher operating temperatures for improved product lifespan relative to traditional SAC alloys.
The Electronics Industry’s Guide to… The Evolving PCB NPI Process is the first book in I-Connect007’s new The Electronics Industry’s Guide to… technical series. This valuable resource is for all segments of the electronics interconnect industry.
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.