Indium Corporation Expert to Present at CSPT


Reading time ( words)

Indium Corporation’s Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test (CSPT) Technology & Marketing Conference, November 8-10, TianShui City, China.

The leap into the 5G era has increased the demand for the performance improvement of mobile phones and the quantity of radio frequency (RF) front-end integrated circuits (IC). In Ultra-Low Residue Flux Application in RF Front-End Package, Hu will discuss how ultra-low residue (ULR) flux, an innovative, truly no-clean, flip-chip bonding material, meets the need for enhanced performance. By using ULR flux, the typical water-wash cleaning process can be removed and, in some instances, package reliability is improved as well. This simplified assembly process will help to reduce total packaging costs. Hu’s presentation will discuss the application of ULR flux on land grid array and quad flat no-leads/dual-flat no-leads package for RF front-end ICs, as well as the reflow process control. The solder joint strength and reliability study will also be shared.

Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at top 10 outsourced assembly and test (OSAT) companies, including Process Engineer, Project Engineer, Senior R&D Engineer, and Chief Engineer. He has a master’s degree in IC Engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.

For more information on Indium Corporation’s ultra-low residue fluxes, visit www.indium.com/fluxes or visit Indium Corporation’s booth.

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Share

Print


Suggested Items

electronica Virtual 2020: Automotive Conference Keynotes

11/16/2020 | Pete Starkey, I-Connect007
While not the same as battling with the traffic to catch the early flight to Munich, followed by an S-Bahn into the city and a crowded U-Bahn to the Messe, electronica 2020 went virtual. Pete Starkey details the Automotive Conference—an event he was particularly keen to attend.

Real Time with… SMTAI 2020: Technical Conference Review

10/06/2020 | Real Time with...SMTAI
SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.

Real Stories of Applied Advanced Analytics in the Electronics Manufacturing Smart Factory

08/26/2020 | Derek Ong, BscEE, Keysight Technologies
The smart factory is starting to become a reality, as part of the overarching Industry 4.0 paradigm. With the technology enablers, such as industrial IoT (IIoT) and cloud computing, electronics manufacturing operational technology (OT) are on a converging course with traditional information technology (IT). Beyond the challenges of data acquisition and transformation, the true “proof in the pudding” is in the quick ROI from advanced analytics. We will share examples of successful, profitable implementation of applied machine learning (ML) in the electronics manufacturing line, where measurement science meets data science.



Copyright © 2020 I-Connect007. All rights reserved.