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Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solder Materials, will present during IMAPS-UK/IEEE-EPS’s online thermal management conference from Nov. 25-26.
Thermal system design is a critical aspect in both high-performance and quantum computing applications. Part of that system is the thermal interface material (TIM). In Advanced Metal Thermal Interface Materials for High- Performance Computing Applications, Jensen will begin with an overview of the thermal demands in these applications. From there, the focus will be on unique TIM technologies that can help enable or enhance active and passive cooling designs to ensure maximum performance. Since the use of metal-based TIMs is proving to be increasingly critical for success, several attributes of various metal TIMs will be reviewed to show how they can ensure the best performance in these applications.
IMAPS-UK/IEEE-EPS’ conference will feature the latest developments in passive and active cooling, materials, measurement, and modelling to address the challenges of enhancing thermal dissipation from advanced electronics systems. The conference will cover all aspects of designing, manufacturing, and testing of high thermal performance electronics, where miniaturization, costs, and reliability are critical features that need to be optimized.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
