SHENMAO Develops New Joint-Enhanced Flux


Reading time ( words)

SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced Flux SMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.

SMEF-Z3 is compatible with solder paste; the flux can be applied after solder paste printing and cured simultaneously during reflow process. The cured flux enhances solder joint reliability. It can be used for pin-transfer and stencil printing processes.

SHENMAO is unique in the research and development of solder materials in Taiwan.

With the global trend of lead-free development, SHENMAO established the Advanced Materials Development Center in Taiwan. The company cooperates with the Industrial Technology Research Institute (Taiwan), Electronics Assembly and IC-packaging manufacturers.

Share




Suggested Items

Pack Your Bags! We’ve Got Your Trade Show Calendar Here

09/23/2022 | Michelle Te, I-Connect007
It’s officially fall, and that means it's time to start planning your trade show attendance. To help you make decisions about when and where to go, we’ve put together a list of industry trade shows. It has been two long years with no or few in-person trade shows, and we’ve felt it. So, now we’re back in business and ready to hit the road. Do you have a show or conference to add to our list? Let us know!

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

How to Minimize Quoting Time and Increase Accuracy in EMS Production

03/30/2022 | Mark Laing, Siemens Digital Industries Software
New product introductions (NPIs) and customization have been increasing rapidly over the past few years—with the results that the already-small profit margins in electronics assembly are shrinking even further. Fifteen years ago, the PCB was the product. Today, most products are a system, with multiple PCBs, cables, and enclosures. Many manufacturers want to provide turn-key products that have multiple BOMs, making the assembly process even more complicated.



Copyright © 2022 I-Connect007. All rights reserved.