The Test Connection’s Bill Horner Remembered


Reading time ( words)

Bill_Horner_dog.jpgWilbert (Bill) August Horner Sr., the founder of The Test Connection Inc. and a well-respected engineer, passed away on September 21, 2020. He turned 81 on September 17.

Bill received a bachelor of science degree in engineering, physics, and computer science from Loyola College and a diploma from Baltimore Technical Institute in electronics, broadcast engineering, and industrial electronics.

Before founding The Test Connection Inc. in 1980, Bill had advanced through 20 years in senior ATE and quality management positions at major corporations, such as GenRad, Bendix, Westinghouse, Plantronics, and Hydranautics.

Bill_horner_IPCshow.jpg

The Test Connection Inc., located in Hunt Valley, Maryland, has been a reliable source for quality test engineering solutions. In light of the growing trend of outsourcing test engineering products and services, Bill founded TTCI and built this test engineering service with the purpose of responding to this need.

Grampa_Bill_Horner.jpgHe proudly served as a member of the U.S. Army in the special Nike Hercules Fire Control Unit. As an active participant in the ATE community, Bill presented papers and co-sponsors events at major ATE seminars and user group meetings. He was a strong advocate for the local Capitol Chapter of SMTA.

Bill was born on September 17, 1939, in Baltimore, Maryland. He was preceded in death by his wife, Margaret Horner. He is survived by Bert Horner and his wife Monica, Michele Reichart and her husband Shawn, and grandchildren Alex, Leah, Addison, and Cooper.

 

 

Share

Print


Suggested Items

Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

12/31/2020 | Graham Naisbitt, Gen3 Systems
The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.

SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures

12/14/2020 | Pete Starkey, I-Connect007
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.



Copyright © 2021 I-Connect007. All rights reserved.