-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
High-Tech, High-Value Cleaning Answers Made Easy With KYZEN’s Tech-2-Tech
November 19, 2020 | Pete Starkey, I-Connect007Estimated reading time: 2 minutes
Thanks to KYZEN’s Tech-2-Tech initiative, I’ve been taking the opportunity to broaden my knowledge of the fundamentals of cleaning electronic assemblies.
Tech-2-Tech offers a wide-ranging selection of well-chosen topics, covering diverse aspects of selecting, evaluating, operating, and maintaining cleaning processes. These were clearly explained in a series of focused 15-minute sessions, each one presented by a different member of KYZEN’s team of industry experts. It’s amazing how much practical information can be effectively transferred and explained in a 15-minute slot, especially one that’s cleverly designed to fit conveniently into the working day with minimum disruption and includes time to grab a coffee!
The series began back in July, led by KYZEN Executive Vice President Tom Forsythe exploring the expectations of a cleaning process and the relative merits of short-term evaluation versus extended field trial for real-life characterisation. “Cleaning products must clean,” he remarked, “Cleaning agents must touch the dirt, and contaminants must be managed.”
Without getting buried in scientific detail, Forsythe described traditional cleaning technology and compared it with the complexity of soils currently encountered, the consequent complexity of the processes required to remove them, and the critical importance of effective rinsing. “It’s about balance and strength—enough solvency power to clean and enough pH to manage the soils and keep them in solution.”
Forsythe also discussed the dynamics of the cleaning process, particularly when operating in a real-world scenario, and the value of gathering and reviewing all the data from a trial before making production decisions. “It’s a long journey, with some ups and downs and some bends in the road. Some days, it rains!”
Subsequent sessions have included discussion of the five forces of cleaning; the significance of pH and how to maintain it; the importance of rinsing; the causes, consequences, and avoidance of foaming; optimisation of cleaner concentration; manual concentration monitoring and the benefits of automated monitoring; determination of process bath life, and overcoming the challenges of cleaning under low-stand-off tight-pitch components.
Recordings of all of these past sessions are readily accessible on-demand online, together with downloads of the corresponding Q&A sessions—practical answers to sensible questions! And, of course, the KYZEN team are always available to respond to any further queries which may subsequently arise.
Still to come, on December 3 at 3:18 p.m. GMT and December 4 at 1:33 a.m. GMT (the alternative time slots to align with North American, European, and Asian time zones) will be Jack Reinke’s session on the environmental impact of a PCB cleaning agent: its potential effect on the waste stream and whether or not to put spent process solution down the drain. A definite date for our diaries!
For those whose primary interest is metal finishing, KYZEN provided a full alternative programme with each session focused on a specific aspect of cleaning in metal finishing. To KYZEN’s great credit, the Tech-2-Tech initiative provides an intelligently constructed agenda of no-nonsense practical information, advice, and guidance for the benefit of decision-makers, engineers, and technical staff engaged in electronics assembly.
Presented in plain language with interesting analogies, KYZEN’s webinar supplies a wealth of valuable information, presented in an informal and easily assimilated style, with intelligent answers to intelligent questions, refreshingly free from commercial promotion.
I have greatly enjoyed the experience and look forward to the next chapter.
Register today at Tech2TechbyKYZEN.COM.
Suggested Items
Solderstar to Showcase Advanced Solutions at EPP InnovationsFORUM 2024
03/18/2024 | SolderStarSolderstar, a leading manufacturer of temperature profiling systems and software for the Electronic Manufacturing sector, is set to showcase its latest innovation at the EPP InnovationsFORUM 2024 in Leinfelden-Echterdingen, Germany on 17th April. Taking centre stage will be the Reflow Shuttle O2 an advanced process verification tool designed to enhance quality control in electronics manufacturing.
OrCADX: High Performance That's Easy to Use
03/14/2024 | Andy Shaughnessy, I-Connect007During DesignCon, I spoke with Chris Banton of EMA about the newest developments around OrCADX, which provides PCB designers with more design automation capability across the whole design process in an easy-to-use GUI. As Chris says, this tool is designed for agile design teams, and features an updated PCB UX, an enhanced 3D engine, SolidWorks integration, and AI for a superior user experience.
Essemtec Exhibiting at IPC APEX Expo at Booth 2409
03/12/2024 | EssemtecEssemtec presents its agile dispensing platform on the TARANTULA machine. The machine can be equipped with five different valves, for a comprehensive range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam, and Underfill.
StenTech to Unveil Cutting-Edge StenTech BluPrint™ CVD Surface Treatment at 2024 IPC APEX EXPO
03/12/2024 | StenTechStenTech® Inc., a leading global company specializing in SMT Printing Solutions, will introduce the new StenTech BluPrint™ Chemical Vapor Deposited (CVD) Surface Treatment at the 2024 IPC APEX EXPO.
BTU to Unveil Aurora in the US at the 2024 IPC APEX EXPO
03/12/2024 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will introduce its award-winning Aurora Reflow Oven Platform, at the upcoming 2024 IPC APEX EXPO.