-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Releases IPC-2581 Revision C for PCB Design
December 1, 2020 | IPCEstimated reading time: 1 minute
IPC-2581C, Generic Requirement for Printed Board Assembly Product Manufacturing Description Data and Transfer Methodology is the eagerly anticipated update of IPC’s widely adopted global standard for PCB design through manufacturing data flow. Revision C introduces groundbreaking new features, automation supporting Industry 4.0, and bidirectional DFX intelligence capability that eliminates the time-consuming back and forth between design house and manufacturers before production can begin.
As technology in the industry progresses, including the latest additive processes with embedded components within the PCB, the IPC-2581 committee of experts has introduced support for the latest technologies, representing every aspect of modern PCB design. Updates include overhauled support for rigid-flex, embedded components, cavities, coins, attenuation parameters, connector ports, pin polarities, edge plating, countersink/counterbore, square drill, and intended net-shorts.
Ensuring that all related data is in digital form, IPC-2581 represents the method of choice for automation between design and manufacturing, significantly surpassing proprietary and legacy formats.
As a specific highlight, revision C includes the bi-directional DFX data exchange through which feedback between design and manufacturing is conveyed and tracked before manufacturing begins.
“DFM checking and resolution can be a frustrating and time-consuming process that poses little overall benefit for our customers” said Greg Link, FAE manager for WUS Printed Circuits. “IPC-2581 revision C addresses the need for a collaborative, executable exchange for DFM issues eliminating spreadsheets, PowerPoints, and emails, accelerating new product introduction for our customers."
“As the industry continues to move toward digital data exchange, the timing is right for the technology behind IPC-2581C to bring the opportunity for critical savings and efficiencies in engineering workload. The update benefits both design and manufacturing, supporting agility and responsiveness within the holistic electronics manufacturing process,” stated Matt Kelly, IPC chief technologist.
“IPC-2581C is also a major component of the digital twin architecture and strategy, setting the standard for interoperability between different digital twin solutions, bringing maximum value from data,” Kelly added. “IPC-2581 revision C is much more than an incremental update, providing the industry’s only fully digitalized and automated data exchange. It is ready to be a critical part of any PCB fabrication and assembly manufacturing smart factory strategy.”
Suggested Items
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
04/23/2024 | GlobalFoundriesGlobalFoundries (GF) is furthering its commitment to sustainable operations and fighting climate change with the announcement of two new long-term goals to achieve net-zero greenhouse gas (GHG) emissions and 100% carbon-neutral power by 2050.
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
04/23/2024 | ROHMROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.
IDTechEx Report Unveils 3D Electronics Status and Opportunities
04/22/2024 | PRNewswire3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
Growth Potential: Electronics Manufacturing Driving Massive Surge in Manufacturing Investment
04/22/2024 | Shawn DuBravac, IPCIn the early months of the pandemic, investment in manufacturing infrastructure, such as plants and production facilities, declined sharply. Real investment dropped over 11%, before finally recovering to pre-pandemic levels in the first half of 2022. Over the past two years, however, several factors have combined to drive manufacturing investment to record levels.