EnviroLeach Fully Subscribes $5.347 Million Private Placement


Reading time ( words)

EnviroLeach Technologies Inc., is pleased to announce that its previously announced non-brokered private placement has been fully subscribed. The Company has received subscriptions for 17,825,001 units (each a "Unit") at a price of $0.30 per Unit for total gross proceeds of $5,347,500. The Company is proceeding with transaction closing which, due to administrative contraints associated with year end and holiday hours, is anticipated to be completed by December 30, 2020.

EnviroLeach's executive team and board of directors wish to thank investors for their support and interest in this pivotal funding, which is allows the Company to execute its multi-faceted business strategy. EnviroLeach is in position to increase operational throughput at its EnviroCircuit printed circuit board processing facility, and to drive adoption of its economic and environmentally sustainable innovations in the gold mining sector.

The proceeds of the Private Placement will be used for the acquisition of feedstock for Enviroleach's printed circuit board assembly processing facility, the continued development of the Company's technologies, and general working capital.

The securities referred to in this news release have not been, nor will they be, registered under the United States Securities Act of 1933, as amended, and may not be offered or sold within the United States or to, or for the account or benefit of, U.S. persons absent U.S. registration or an applicable exemption from the U.S. registration requirements. This news release does not constitute an offer for sale of securities for sale, nor a solicitation for offers to buy any securities.

Share

Print


Suggested Items

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

IPC Standards Development: Business Challenges and an Inside View

10/28/2020 | Graham Naisbitt, Gen3 Systems
With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.

SMTA Additive TechXchange Keynote: An Outlook on Advanced PCB Fab

10/20/2020 | Pete Starkey, I-Connect007
Organised as a virtual event by Lenora Clark of ESI Automotive and Tara Dunn of Omni PCB, SMTA’s Additive TechXchange addressed additive technology specifically in the context of the electronics industry. Pete Starkey details the keynote presentation, an outlook on advanced printed circuit board fabrication, from Jeff Doubrava, managing partner at Prismark Partners.



Copyright © 2021 I-Connect007. All rights reserved.