I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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We started this week with the solstice. Here in the Northern Hemisphere, it’s the winter solstice; south of the equator, of course, it’s the summer solstice. Not only is this a big event on the astronomical calendar, solstice is a busy time for holy days worldwide. Whichever holiday schedule you follow, we wish that yours is festive, restorative, and full of hopefulness.

All that holiday revelry can certainly distract one’s attention; as evidenced in a much slower news week. As a result, this week’s Top 5 brings you the three most important and/or intriguing pieces of news we’ve covered in the last week, and two items from last week that are still drawing reader attention this week.  That’s I-Connect007: Keeping you informed, efficiently.

Enjoy your holiday and Happy New Year!

Prices of Copper-Clad Laminates Continue to Rise
December 18

Recently, two major explosions at epoxy resin plants in China had a great impact on domestic resin suppliers, interrupting the supply of resin and caused prices to increase dramatically. I-Connect007 reports on the market dynamics and effects.

U.S. Congress Approves Funds for R&D on Lead-Free Electronics in Aerospace, Defense and High-Performance Applications
December 22

The press release states, “Industry experts believe a five-year, $40 million investment in a public-private R&D program would yield more than $100 million in U.S. defense savings per year and improve military readiness and overall innovation. The Congress provided $5 million for such R&D in FY 2020.”

For more detail, find IPC President and CEO John Mitchell’s article in Defense News titled, “Protecting America’s military prowess requires an embrace of lead-free electronics.”

COMSovereign Delivers First Tethered Drone-Based LTE Network
December 21

Emergency and disaster response teams are a great example for this new LTE mobile network system. Imagine a wildfire command post setting up on a remote hilltop and launching a series of hovering drones to serve as temporary cell towers in an area otherwise outside cell service.

Dr. John Mitchell on IPC APEX EXPO Going Virtual
December 16

In this audio interview, Barry Matties and Dr. John Mitchell discuss IPC’s decision to move IPC APEX EXPO 2021 to an all virtual platform. Mitchell explains the reasoning for going virtual, and expresses his enthusiasm for the opportunities this presents the conference. I-Connect007 will be providing preshow and realtime coverage of IPC APEX EXPO, so check with us often to get the latest.

Happy Holden: ECWC15 Virtual Event a Success
December 15

Few industry experts are as capable as Happy Holden to review the Electronic Circuits World Convention, held recently in Hong Kong. In this report, Happy summarizes the keynotes from the first day of the three-day event. Keynote speakers include: NT Information Ltd’s Dr. Hayoo Nakahara; James Tam, from Bosch; and Happy Holden himself.

  

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/08/2021 | Nolan Johnson, I-Connect007
It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way.

IPS Expanding to Accommodate Growing Market

11/24/2020 | Barry Matties, I-Connect007
I recently had the opportunity to visit IPS in their Cedar City, Utah, facility, where Mike Brask, founder and president of IPS, shared his business strategy and gave me a tour of the expanding manufacturing facility. IPS produces a wide range of PCB manufacturing equipment, including plating, DES, VCM, VRPs, ventilation, and spare parts for older equipment.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

11/20/2020 | Andy Shaughnessy, Design007 Magazine
In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention. We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.



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