TRI Launches New High-Reliability 3D AOI Solution

Reading time ( words)

Test Research, Inc. (TRI), a leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-reliability TR77000QM SII 3D AOI.

The TR7700QM SII is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry and other high reliability industries.

As the miniaturization of components and PCB boards increases, the demand for resolution inspection increases; TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false call rates. TRI’s 3D AOI technologies range from Depth from Focus (DFF), 3D Blue Laser, and Moiré projection for virtually Zero-escape Inspection.

11/03/2020 | Nolan Johnson, I-Connect007

Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

10/20/2020 | Pete Starkey, I-Connect007

Organised as a virtual event by Lenora Clark of ESI Automotive and Tara Dunn of Omni PCB, SMTA’s Additive TechXchange addressed additive technology specifically in the context of the electronics industry. Pete Starkey details the keynote presentation, an outlook on advanced printed circuit board fabrication, from Jeff Doubrava, managing partner at Prismark Partners.

07/01/2020 | I-Connect007 Editorial Team

Chris Peters represents the U.S. Partnership for Assured Electronics, where he advocates for electronics manufacturing as a critical industry. Here, he describes the current status, the supply chain, and what he sees in Washington, D.C.