Optomec Launches New 3D Additive Electronics Printer for Inline Production


Reading time ( words)

Optomec is announcing a breakthrough advanced electronics packaging solution to meet the perpetual demand for miniaturization of mobile and wearable products. The Aerosol Jet HD2, uses Optomec’s patented Aerosol Jet 3D Electronics Printing solution to produce high resolution circuitry, including a unique ability to dispense conformal 3D interconnects between die, chips, components and substrates. This interconnect approach is all the more powerful due its improved performance at high frequencies, especially for 5G and mmWave applications. 

Optomec’s Aerosol Jet HD2 targets the existing $4 Billion market for back-end Semiconductor Packaging and Assembly equipment. This includes competing technologies such as wire bonding and dispensing, where shipments average 5,000 – 10,000 machines annually.

The Aerosol Jet solution works by precision jetting or “printing” an extremely fine mist of nanoparticle-based inks onto a surface. The HD2 can print features as narrow as 10 microns with placement accuracy under 5 microns. The nanoparticles are then sintered together, forming a solid metal conductor of copper, gold or silver. Insulating and adhesive materials can also be applied by the Aerosol Jet process with a variety of common IC packaging dielectric materials.

As a primary application, the Aerosol Jet HD2 can serve as a drop-in replacement for the decades-old method of connecting electrical components with wire bonds, which suffer from several critical deficiencies. First, wire bonds require high impact mechanical contact with the IC, often producing scrap, especially with fragile, next-generation gallium-based chips. Second, wire bond loops require extra space within the package, making it harder for designers to create sleek, miniature devices to meet the demands of consumer electronics. Third, wire bonds can choke off the high frequency mmWave signals required for 5G communications, automotive radar, and many other emerging applications. 

“The HD2 really changes the way designers think about IC packaging.” said Bryan Germann, Aerosol Jet Product Manager. “Not only can it reduce the size of the final electronics package, but it also out-performs wire bonding when it comes to high-frequency signals. Wire bonds simply produce a lot of inductance for RF applications above 40 GHz”.

The HD2 electronics printer can also be used to print transmission lines, sensors and antennas on a wide variety of materials including common polymers, IC materials, FR4, glass, ceramic and even metals.  The HD2 was designed for high volume manufacturing and includes production-friendly software that guides operators through a simplified start-up process, ensuring QA compliance. The machine is also available with an in-line conveying option for automated part loading. It can process substrates or part trays up to 300 mm wide and is available with a rotate table for 4-axis processing.

Share

Print


Suggested Items

SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures

12/14/2020 | Pete Starkey, I-Connect007
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

How to Benefit From Robotic Soldering Processes

10/28/2020 | Pete Starkey, I-Connect007
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.



Copyright © 2021 I-Connect007. All rights reserved.