Dymax Launches New Light-Curable Low-Shrink OP-81-LS Epoxy

Reading time ( words)

Dymax, leading manufacturer of rapid light-curing materials and equipment, introduces Low Shrink™ OP-81-LS epoxy that cures in seconds upon exposure to broad-spectrum light for fast, precise optical assembly.

OP-81-LS has very low volumetric shrinkage during cure, low coefficient thermal expansion for stability through thermal excursions, and meets ASTM E595 outgassing requirements making it ideal for the positioning and bonding of lenses, prisms, fibers, or other optical components. The material does not react until exposed to light, so manufacturers have time to accurately align parts before assembly and cure.

The epoxy features a low temperature (80-85°C) heat-curing function in applications where shadow areas exist or where only heat-cure is preferred. The material is solvent free and one component, requiring no mixing. Low-Shrink OP-81-LS is designed to bond dissimilar substrates, including polycarbonate, glass, acrylic, and metallic surfaces and is well suited for use in consumer electronics applications.





Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad

12/16/2019 | Alfredo Garcia, et al, Sanmina and Nokia
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.

Copyright © 2021 I-Connect007. All rights reserved.