3CEMS Group Prime Base Honored with II-VI's Sapphire Supplier of the Year 2020

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II-VI Incorporated has recognized 3CEMS Group Prime Base with the Sapphire Supplier of the Year 2020 for their outstanding performance in 2020. II-VI Global Supplier Awards are given in recognition of 3CEMS Group Prime Base’s excellence in collaborating with II-VI to achieve the highest levels of performance, innovation, and service. Only the highest-achieving suppliers are awarded this honor.

06/12/2020 | Nolan Johnson, I-Connect007

On June 10, Nolan Johnson spoke with Burak Aksoy, technical service and development scientist for Dow Silicones. Aksoy updated Johnson on the recent introduction of DOWSIL™ EA-3838, a fast-curing adhesive formulated for use in industrial manufacturing and assembly applications.

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA

Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

07/08/2019 | Tony Lentz, FCT Assembly

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. And the question commonly asked is, "When should we switch from Type 3 to a smaller solder powder?" Read more to find out.