MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai


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The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.

ALPHA OM-372 is designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004). A combination of these best-in-class features as well as excellent HIP and NWO performance makes it ideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor components.

MacDermid Alpha will also be promoting its latest ALPHA HiTech bonding materials including the newly launched ALPHA HiTech Underfill and Edgebond products featuring high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance.  ALPHA Argomax® sintering process solutions and new technology for flexible formable and printed electronics will also be featured.

For additional information about MacDermid Alpha's latest technologies and products, please visit Booth #E4-4702 at Productronica China, or visit MacDermidAlpha.com

Productronica China 2021
Date: March 17-19, 2021
Venue: Shanghai New International Expo Centre
Booth# E4-4702

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, Kester and MacDermid Enthone brands, we provide solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.   The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.  

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