Solder Paste Innovations and Low-Temperature Assembly


Reading time ( words)

Paul Salerno, MacDermid Alpha's Global Portfolio Manager SMT Assembly Solutions, discusses no-clean pastes designed to maximize electrochemical reliability with fine-pitch, low-standoff components and describes latest innovations in ultra-low-temperature soldering technology.

We invite you to visit Real Time with...IPC APEX EXPO 2021 for all the interviews produced by I-Connect007 in partnership with the IPC. Video and audio content is available now at realtimewith.com.

Later this month, watch for Real Time with...IPC APEX EXPO 2021 Show & Tell 2021, our celebrated special annual post-show magazine. We compile and highlight all of our show-related content and deliver it to current my I-Connect007 registrants.

To watch this Real Time with… IPC APEX EXPO interview, click here.

 

Share

Print


Suggested Items

Real Time With… IPC APEX EXPO 2022: Blackfox Mixes It Up with Training Opportunities

01/11/2022 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy speaks with Jamie Noland, master IPC trainer and marketing manager for Blackfox Institute, about current and upcoming training opportunities and what you can expect from them at the show. Blackfox has expanded its offerings to reach a wider audience, including some very basic classes for beginners.

ProMetrics: An Easy, Smart Solution

01/05/2022 | I-Connect007 Editorial Team
Rehm's Michael Hanke speaks about the product on process and the advantages of live process monitoring with ProMetrics, Rehm’s newest monitoring tool, which is brand new and unique in the market. Users say that it’s easy to use and, more importantly, that it provides the security in a system they are looking for.

Don’t Miss Further Discussion of Materials Testing in GEN3 Episode 6 of ‘Predicting Reliability in Electronics’

12/22/2021 | I-Connect007 Editorial Team
The sixth episode, “Materials Testing—Process Materials,” can be viewed in under four minutes. Presenters share information on paste vs. flux vs. rework, limitations of standards, hand soldering/rework cautions, and more. Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive, or general industrial applications.



Copyright © 2022 I-Connect007. All rights reserved.