Hentec/RPS Setting Component Lead Tinning Standards and Compliance

Reading time ( words)

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that its entire series of Odyssey component lead tinning machines provide full compliance with all applicable industry standards. The Odyssey 925, 1325 and 1750 component lead tinning machines perform component re-conditioning in accordance with all relevant GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.  The full line of Odyssey 925, 1325 and 1750 component lead tinning machines are specifically designed to perform component re-conditioning including re-tinning, gold removal and BGA de-balling for high reliability and military applications.

The Pulsar solderability test equipment performs the industry accepted dip-and-look test method for rapid solderability results that can easily performed on the shop floor.  In addition, the Photon steam aging system is designed to provide artificial aging and accelerated life testing to simulate elongated component storage conditions.

03/03/2021 | Nolan Johnson, I-Connect007

Nolan Johnson speaks with Super Dry’s Richard Heimsch about how the need for dry storage solutions has increased throughout the pandemic, including further demands for traceability and automation capabilities.

02/22/2021 | Dan Beaulieu, D.B. Management Group

Dan Beaulieu catches up with Sean McConville, vice president of business development at Niche Electronics, who shares his background in the industry, the strengths of his company, and how the pandemic has affected its business.

01/20/2021 | Nolan Johnson, I-Connect007

Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.