Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data, Chapter 2

Reading time ( words)

The following excerpt is from The Printed Circuit Assembler's Guide to...™ Smart Data: Using Data to Improve Manufacturing book.

Chapter 2: The Difference Between Data and Analytics
Companies have been collecting data in large volumes. Highly varied data from manufacturing operations comes in quickly that needs to be validated, and its value prioritized so that it can be turned into something useful—transformed from big data to smart data. The amount of data available has grown exponentially into big data. Twenty years ago, a PCB work order resulted in 100 data records, megabytes of data; today, it is 10 billion records, terabytes of data. The investment in collecting this data and storing it is high. However, without a way to analyze the data, without analytics, it will not result in ROI.

Using analytics provides the best results with high-quality data. However, with bad or non-validated, and inappropriately prioritized data, the most advanced analytics still can be misleading and a waste of time. What is high-quality data? It is data that has been normalized, formatted, and validated so that it can be translated and read to provide insights and foresight. It is data that can be understood at the point of consumption and be immediately acted on.

Data analytics is the process of examining data sets to draw conclusions about the information they contain. Manufacturing intelligence means taking big data, applying advanced analytics, and putting it back into manufacturing processes.

Analytics for manufacturing can be used in:
• Asset management for accurate, real-time utilization, and OEE
• Traceability for capturing and investigating complete material and process traceability data for individual PCBs, as well as full system assemblies, using high-availability big-data storage
• Operation and labor management to measure and analyze how resources are spent and track WIP in real-time
• Quality control to identify and analyze process and material failures and drive continuous improvement
• Design-to-manufacturing flow to detect factors affecting yield and point out areas for improvement

To download this free eBook, published by I-Connect007, click here.

To view the entire I-Connect007 eBook library, click here.

Other related content

I-Connect007 Column: Lean Digital Thread, from Sagi Reuven, Siemens Digital Industries Software


Suggested Items

Assemblers Play the ‘Revise or Wait’ Game With Designers

06/22/2022 | Nolan Johnson, I-Connect007
Nolan Johnson recently spoke with Duane Benson at Milwaukee Electronics and Screaming Circuits. Duane was pointing out a trend in moving designs into production, which he termed “revise or wait.” This excerpt provides a preview of our exploration of similar topics involving supply chain issues, lead times, and proceeding forward despite the supply challenges.

How Will Emerging Chiplet Technology Affect PCBs?

06/01/2022 | I-Connect007 Editorial Team
In a recent conversation with Ventec’s Alun Morgan, the I-Connect007 Editorial Team discussed, among several topics, semiconductor packaging developments. Industry insiders will know that, when you get Happy Holden and Alun Morgan talking about emerging technology trends, there will be insights shared.

Getting Involved Earlier in the Test Process

04/18/2022 | Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.