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Retronix Installs Hentec/RPS Lead Tinning Machine in Scotland Facility
May 5, 2021 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation is pleased to announce that Retronix Ltd. has installed a Hentec/RPS Odyssey 1750 robotic hot solder dip machine in their Scotland facility. The Odyssey 1750 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys.
Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1750 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
Suggested Items
VDMA: Machine Vision Navigating Through Uncertain Times
04/18/2024 | VDMAFor over a decade, the European machine vision industry has reported steady growth, with turnover increasing by an average of 9 percent annually between 2012 and 2022. Despite a temporary setback in 2020 (minus 4 percent) due to the Covid-19 pandemic, the industry rebounded strongly in 2021 (plus 17 percent) and 2022 (plus 11 percent).
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsIn this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.
Panasonic Connect to Showcase New Automated Manufacturing Solution at IPC APEX Expo 2024
04/10/2024 | Panasonic Connect North AmericaPanasonic Connect North America will showcase its smart manufacturing solutions at IPC APEX Expo 2024, including its brand new NPM-GH Pick-and-Place machine.
NetVia Group Acquires Direct Imaging from Mivatek
04/09/2024 | Miva TechnologiesMiva Technologies is pleased to announce NetVia Group, Irving, TX has acquired a new Miva 2400NG Dual Tray Direct Imaging System with 30-micron capabilities for inner, outer and soldermask imaging.