MacDermid Alpha Presents ‘Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection’ at SNEC 2021

Reading time ( words)

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting a technical paper, "Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection," at the SNEC 15th (2021) International Photovoltaic Power Generation and Smart Energy Conference & Exhibition taking place in Shanghai, China on June 2-5, 2021.

The paper, ‘Advantages of Prefluxed Ribbon-Wire in Multi Busbar Interconnection’ will be focusing on the ALPHA Ready Ribbon technology in multi busbar (MBB) cell tabbing and stringing applications.“Multi Busbar (MBB) interconnection is gaining popularity and has been in mass manufacturing to some extent. Due to the reduced cross-sectional area of the silver pad and soldering wire, the reliability of solder joints remains one of the biggest challenges in this technology. Pollution associated with fluxing operation is another major problem. In addition, lowered peel strength, wire misalignment, wire crippling and cold or dry solder joint formation are often reported issues.” said Narahari Pujari, Global Technology Manager-PV of MacDermid Alpha. “Alpha’s PV Ready Ribbon (RR), available in the prefluxed ribbon or wire promises to alleviate some of these problems. In this technology, the flux is uniformly pre-applied on the wire to a controlled amount. This flux is designed to be pliable so it does not chip or flake during handling or feeding in automated Combined Tabbing and Stringing (CTS) equipment,” he continues.

Findings from Pujari’s paper confirm that ALPHA Ready Ribbon eliminates the need for module assemblers to apply liquid flux during automated stringing operations. This virtually eliminates all the effort and costs associated with buying, storing and using a liquid flux. Excellent peel strength and minimum pollution on tools are the additional benefits of this technology. The modules assembled using ALPHA Ready Ribbon pass thermal cycling and damp heat reliability testing according to IEC specification. Results further confirm that the new ALPHA Ready Ribbon wires can be introduced to the existing multi busbar module manufacturing line at no extra costs or process change.

For more information on ALPHA Solder Interconnect Technology or solutions for Photovoltaic applications, visit


Suggested Items

Four Silver Linings in the Stormy Clouds of Pandemic, Supply Chain, and Inflation

09/14/2022 | Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.

Thriving Through Greater EMS Collaboration

08/23/2022 | Chris Peters, USPAE
Events of the past two years have clearly demonstrated the value of strong trading relationships. When materials become constrained, as in the recent microchip shortage or any of the pandemic-driven supply chain snafus, the companies that have those materials have a choice to make. Which customers will be put at the front of the line, and which will be placed at the rear? Too often, company executives assume that since they are a large buyer, they automatically will be prioritized when supplies are constrained. Research has shown that this is not always the case, and that assumption can leave a company in a weakened position.

New Book from I-Connect007 Examines Evolution of Electronics Industry NPI

08/01/2022 | I-Connect007
The Electronics Industry’s Guide to… The Evolving PCB NPI Process is the first book in I-Connect007’s new The Electronics Industry’s Guide to… technical series. This valuable resource is for all segments of the electronics interconnect industry.

Copyright © 2022 I-Connect007. All rights reserved.