TRI launches New High-Speed 3D SPI


Reading time ( words)

Test Research, Inc. (TRI) presents the release of the new 3D high-speed solder paste inspection (SPI) solution TR7007 SII Ultra, performing at an industry-leading speed of up to 180 cm2/sec.

The TR7007 SII Ultra is built on the highly popular and award-winning TR7007 SII Plus Series and an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The TR7007 SII Ultra can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.

Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.

Share

Print


Suggested Items

EIPC Technical Snapshot: Cleanliness

03/01/2021 | Pete Starkey, I-Connect007
John Ling’s invitation to the fifth in EIPC’s series of Technical Snapshots was as droll as we have come to expect: “In these confined days of lockdown, and exhortations to stay at home and only go out for exercise, this only exercises the natural inclination to hop on a ‘plane to some sunshine.’ Although not the same as Factor 20, one of our webinars gives a high degree of protection from harmful ignorance, and you do not have to go out in the cold.”

Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

12/31/2020 | Graham Naisbitt, Gen3 Systems
The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.

SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures

12/14/2020 | Pete Starkey, I-Connect007
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.



Copyright © 2021 I-Connect007. All rights reserved.