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AIM Solder, a leading global manufacturer of solder assembly materials is proud to be celebrating its 85th anniversary.
Founded by Peter Black, AIM’s humble beginnings started in 1936 as a scrap metal recycling company located in Montreal, Canada, and remains privately held by the Black family today. What started as a small, family-owned operation has evolved into a world-leading, multi-faceted manufacturing company of virgin-grade materials for the electronics industry, with production facilities located throughout the world.
In an extremely competitive market, AIM recognizes that today’s electronics manufacturers require suppliers that can provide them with solutions to the increasing demands of the electronics industry. The company sets itself apart with the exceptional technical support it provides to its clients. AIM’s dedicated team of engineering professionals is committed to providing top-notch solutions to the challenges its partners may face.
AIM’s innovative research and development team is strongly committed to product and process improvement. The company invests a significant portion of its annual revenues in research and development, ensuring its position as an industry leader.
“We have achieved this milestone through the hard work and dedication of our team members and the customer-centric culture that exists throughout our entire organization,” said AIM’s President, Ricky Black. “AIM will maintain the character of a family-owned company and continue to provide unmatched value to our clients by offering a combination of world-class products and unparalleled support wherever they may operate.”
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.