BTU to Show Selective Soldering, Vacuum Reflow at NEPCON South China


Reading time ( words)

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.

The Valence 3508 was designed for high mix, high volume, high-level PCB production. The continuous duty, multi-station, in-line selective soldering machine utilizes an electromagnetic pump. The Valence 3508 can be programmed in minutes and is highly configurable and customizable. With a three-shift processing area and stainless-steel ball screws, the Valence 3508 selective soldering system increases production efficiency and reduces downtime associated with maintenance.

The PYRAMAX Vacuum reflow oven has been designed to meet the solder voiding requirements and high-volume demands of electronics assembly and semiconductor packaging applications. The unit is configured with 10 zones of closed-loop convection heating, two zones of convection vacuum chamber heat assist and an internal vacuum chamber heater for precise profile control.  The vacuum chamber can accommodate a maximum product size of 18” by 18”. Nitrogen atmosphere capable, the PYRAMAX Vacuum reflow oven offers a maximum process temperature of 350° C.

Share




Suggested Items

Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells

07/26/2022 | Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

KIC Adds Wave Monitoring Technology to Industry 4.0 Ecosystem for Thermal Processes

04/13/2022 | Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.



Copyright © 2022 I-Connect007. All rights reserved.