Soldering and Joint Encapsulation with One Step Reflow from SHENMAO


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SHENMAO America, Inc.’s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

The new epoxy-based solder material is designed for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly. It is compatible with various surface finishes, with a transparent residue and no cleaning required. 

SHENMAO’s JEP is eco-friendly with both lead-free and halogen-free. Halogen can generate hazardous gas at high temperature and the use is restricted. SHENMAO halogen-free JEP materials meet J-STD standard (≦1000ppm Chlorine/ ≦ 1000ppm Bromine) and IEC standard (≦900ppm Chlorine/ ≦ 900ppm Bromine/ ≦ 1500ppm Total halogens). 

SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.

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