Rehm Thermal Systems to Hold Careers Day October 17


Reading time ( words)

Smartphones, aeroplanes, cars, pacemakers: The quality of Rehm Thermal Systems can be found in many different products. For more than 30 years, the Blaubeuren-based company Rehm has been a technological leader for high-quality, durable electronics. Would you like to become part of this success story too? Would you like to get off to a flying start professionally, start an apprenticeship or a dual study programme with a future or reorient yourself? Get to know Rehm Thermal Systems – during the Careers Day on 17 October 2021, from 10 a.m. to 3 p.m. on the company premises in Blaubeuren-Seissen, Leinenstraße 7!

As a specialist with more than 30 years of experience in the field of thermal system solutions for electronics manufacturing, Rehm Thermal Systems is positioned worldwide and has made a name for itself internationally with high-quality mechanical engineering. During the Careers Day on 17 October, the company will be presenting its wide range of entry-level opportunities – whether as a specialist or manager, as an apprentice or as a dual student. “We’re looking forward to a successful Careers Day with many interested individuals seeking to discover more about us, our company and our career opportunities – and we’re looking forward to meeting qualified future employees,” emphasises Joachim Erhard, HR Manager at Rehm. This year's Careers Day at Rehm Thermal Systems will focus on the various entry-level opportunities, particularly in the specialist areas of software, service, production and application. The diverse training and dual study opportunities in the technical and commercial areas will also be presented.

Have we piqued your interest? Come by on 17 October 2021 between 10 a.m. and 3 p.m. on the company premises of Rehm Thermal Systems, Leinenstraße 7, 89143 Blaubeuren-Seissen. Take advantage of this opportunity and talk to the various experts and HR professionals directly on site about career entry and development opportunities at Rehm. You are also welcome to bring along current application documents and discuss them with the HR Team.

Share

Print


Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad

12/16/2019 | Alfredo Garcia, et al, Sanmina and Nokia
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.

Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

07/22/2019 | Keith Sweatman, Nihon Superior Co. Ltd
In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.



Copyright © 2021 I-Connect007. All rights reserved.