-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Averatek to Present 'Reliability of Solder Joints on Flexible Aluminum PC Boards' at SMTAI
October 6, 2021 | AveratekEstimated reading time: 1 minute
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored “Reliability of Solder Joints on Flexible Aluminum PC Boards.”
Most surface mount technology has primarily focused on developing products for mounting SMDs onto copper-based rigid or flexible printed circuit boards (Cu-PCBs). Aluminum has several advantages compared to copper: it is less expensive, and has about one-third the density of copper, making Al-PCBs much lighter than Cu-PCBs.
Surface treatment of aluminum includes Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet chemistry, and cost-prohibitive for mass adoption. Conductive adhesives like Anisotropic Conductive Paste (ACP) are an alternative, but result in component-substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented to address all of these constraints: a breakthrough pretreatment that allows for soldering to aluminum as easily as to copper - with significant benefits over traditional methods of soldering to aluminum.
Additionally, the presenters will discuss functional aluminum circuits, study of solder-aluminum bond, shear results and SEM/ EDS analysis. They will explain how these mounted assemblies on Al/PET containing various resistors and other components pass the surface insulation resistance test (SIR) as well as temperature cyclic tests between -40° C to 105° C for more than 500 cycles. The solder joints formed are quite strong and in the shear tests, the failure occurs at the Al/PET interface. The solder fillets formed using low temperature solders (138° C melting point) are robust, with minimal voiding as evidenced from X-ray studies and cross-section optical microscopy studies.
Suggested Items
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.