Michael Cappello Appointed Enics Chief Business Officer

Reading time ( words)

Enics Appoints Michael Cappello as Chief Business Officer and member of Enics Management Team to enhance growth and superior customer experience.

Enics is on a strong growth path and committed to serve the customers’ electronics value chain as a valuable partner. To enhance the focus on profitable growth and providing sustainable solutions and superior customer experience, Mr Michael Cappello is appointed Chief Business Officer and member of Enics Management Team as of October 4th 2021. He will be in key role in building Enics growth path to become a 1-billion-euro company. 

“Enics is on a path to growth and new, exciting future. Our growth involves not only scaling up our current business, but also transformation from an electronics manufacturing company to a full turnkey-service provider in industrial electronics. This transformation requires new approaches, new mindset and new kind of knowhow. Therefore, I am especially thrilled to welcome Michael Cappello to the team! His profound experience with different industries and his focus on building customer success throughout his career will accelerate Enics development to our common future direction to partner with our customers to serve the full electronics value chain by best performance and innovative solutions. I am looking forward to the developments and openings which Mr. Cappello will bring to Enics”, says Elke Eckstein, President and CEO of Enics.

Mr. Cappello has extensive experience in General Management, Strategy, Business Development, Marketing and Sales and Product and Service Development, having held several EVP and CEO positions during the last 25 years, in international leading companies. His experience with industrial companies in challenging market environments makes him a valuable addition to Enics Management Team.

04/26/2023 | I-Connect007

In this episode, Koh Young topic expert Ivan Aduna examines how closed-loop communication can make all the difference when it comes to inspection and achieving zero defects in your production line. Ivan also explores the importance of equipment suppliers working together to create M2M connections that allow for real-time exchange of SPI and AOI measurement data between machines—all in under four minutes.

11/19/2014 |

The implementation of surface-mount devices is crucial for smartphone manufacturers, offering increased component density and improved performance. Mobile products generally use an epoxy underfill to adhere components to the PCB to meet the mechanical strength requirements of a drop test. Reworking glued components is the most difficult application in the electronics industry, and must be addressed as a process.

10/15/2014 | Scott Zerkle, Yamaha Motor IM America Inc.

Today's robots can solve many manufacturing issues and are more cost effective than the ongoing costs of human labor. The purchase of a robot is a three- to five-year payoff, after which the expense is reduced to maintenance and utilities. A robot that matches the cycle time of the manual operation will most certainly surpass a human in efficiency over time.