2021 International Electronics Circuit Exhibition (Shenzhen) Coming December 8-10

Reading time ( words)

The 2021 International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show) will move to a new venue and to be held at the Shenzhen World Exhibition & Convention Center (Bao’an) for the first time from 8-10 December 2021. Staging along the theme of ‘5G Connecting the World’, the Fair is jointly organized by Hong Kong Printed Circuit Association (HKPCA) and China Printed Circuit Association (CPCA). It will again showcase innovative products, technologies and solutions from the whole supply chain in the industry, expediting and sustaining the development of 5G integration and innovation. 

New Venue · Breakthroughs · New Opportunities

A bigger event covering 80,000 square meters of show floor area


To be held at the Shenzhen World Exhibition & Convention Center (Bao’an) for the first time, this year the Fair will occupy Halls 5, 6, 7 & 8. The show scale has expanded by over 50% when compared with the 2020 edition, with show floor area expecting to reach 80,000 square meters.

The rapid commercial deployment of 5G networks reshapes the electronics industry, bringing the industry to a new era. As one of the world’s largest international exhibitions in PCB and EA industry, HKPCA Show will grasp the trend of 5G to gather leading brands, new enterprises, industry leaders and technology professionals to showcase new technologies and innovative products in PCB industry. Visitors to the Fair can know more about the latest trends, inspiring solutions, as well as getting learning opportunities to equip themselves to tackle challenges amidst an increasingly competitive market, thereby promoting a sustainable development of the industry. 

Over 600 exhibitors have confirmed their participations, including leading and emerging brands


The booth allocation meeting in late August has drawn an enthusiastic response from exhibitors. Over 600 exhibitors have confirmed their participations, making it a sold-out event this year again with the numbers of booths close to 4,100.

Leading brands and new enterprises will showcase their innovative products and solutions, fully demonstrating the whole supply chain of PCB and EA industry driven by 5G. These include TTM, Topsearch, Founder, ELEC & ELTEK, China Eagle , Allfavor , WKK, Atotech, Harvar, Schmoll, Jadason, Orbotech, Han’s CNC, C Sun, Protek, Worldwode, Universal P.C.B., Boffotto, Joint Stars, Machvision, Zhengye, ISOLA, Guanghua, Lauffer, Screen, Kingboard, Process Automation, Taliang, Dongwei, Daidalos, Chaohua Tech, San-Eikagaku, Magneto, Accutech, , Keyence, DuPont, Inovance, ZWSOFT, Inno, BU-Laser, LEAD , G. WEIKE , WUJO HIGH-TECH , Zhongde Nawei , Jiuyao , Blihe , WangHong , Rockent , Glorysoft, ROKAE , OPTON , and many more.

Many exhibitors recognize the Fair an indispensable business platform for PCB and EA industry as it enables them to gain better understanding on customers’ needs and develop more new sales networks. Through information exchange with industry players at the Fair, exhibitors can also get inspirations for their R&D to meet the demand for new technologies, such as 5G, new infrastructures, artificial intelligence (AI), big data, Internet of Things (IoT) and cloud computing. This helps them maintain their competitiveness and seize opportunities for further development.

Concurrent activities and Virtual Exhibition provide platform for in-depth and extensive exchange and discussion

The highly popular concurrent activities are other highlights of the Fair. International Technical Conference will feature notable industry experts and leaders to shed lights on the latest market trends and cutting-edge technologies, while the Golf Tournament will offer networking opportunities for industry players to cultivate business relationship in a relaxing atmosphere.

Launched in 2020, the Virtual Exhibition was well-received. This year, the Virtual Exhibition will be continued to offer a platform without time and geographical constraints, which facilitates industry people to establish more business connections with exhibitors.

Follow the Fair on WeChat, official website and Linkedin for the latest show news.

Please visit the Fair’s official website at www.HKPCAshow.org or scan the QR codes below on WeChat and Linkedin to receive the latest show news.

About Hong Kong Printed Circuit Association (HKPCA)

HKPCA is a non-profit-making trade association, founded in 2000 by a group of Hong Kong PCB manufacturers. We are also a member of the World Electronic Circuits Council (WECC), which allows us to maintain closer connections with overseas printed circuit associations. Other WECC members include: CPCA, EIPC, ELCINA, IPC, IPCA, JPCA, KPCA, THPCA and TPCA. As the unique representative of the Hong Kong PCB industry, we aim to promote and maintain the rights and interests of the industry.  The role of the association is to liaise and facilitate communication within the PCB industry locally and internationally through a diversified communication platform. HKPCA also represents the industry by providing our ideas and opinions to the government and relevant organizations. To provide better services, different sub-committees have been set up to organize activities for our members. We hope to keep members updated with current market trends and expand their knowledge in advanced technology through our annual tradeshow, quarterly publishing, frequent training and seminars. HKPCA publishes an annual market survey report after interviewing key manufacturers and equipment suppliers in the industry within Hong Kong and South China. Through the report, we hope the information can assist enterprises to develop their business and technology required in the industry. We attend relevant conferences and exhibitions around the world to collect as much as information and news for our members. As many members have set up production base in China, HKPCA have put forth efforts on collecting information from the Chinese government, such as environmental, customs policies and regulations, and sharing them with members. In addition, opportunities and developments are encouraged by the technical seminars, conferences, training courses, conventions and exhibitions that are organized for the industry in Hong Kong and China.

For more information, please visit www.hkpca.org.

About China Printed Circuit Association (CPCA)

China Printed Circuit Association (CPCA) is the national grade one association approved by the Ministry of Civil Affairs of the People’s Republic of China and led by the Ministry of Industry and Information Technology Department. Established in June 1990, CPCA members mainly consist of PCB producers, CCL and material suppliers, special equipment manufacturers, SMT and EMS suppliers and related colleges and research institutes. CPCA has nine national grade two branch associations and 800 members. CPCA organizes enterprises to participate in the development of CPCA and WECC standards; composes joint standards with IPC and JPCA; participates in the development of standard custom tariff terms and the unit consumption standards; publishes printed circuit information newspapers and magazines; hosts CPCA annual international exhibition in March; holds annual Spring and Autumn international PCB information/Technology forums; conducts workers skill training and organizes different kinds of lectures; carries out industry survey and issues annual industry development report; releases the annual China Printed Circuits Industry Top 100 Enterprises List etc.


Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.