Nepcon Shenzhen Delivers on Promises for Europlacer


Reading time ( words)

As one of the world’s first trade shows in the electronics sector to return as an in-person event, Nepcon Shenzhen appears to have delivered on expectations. For the Europlacer China team, the exhibition was special in another way, being the first time that the company has exhibited at the Shenzhen show for 14 years.

While strict Covid regulations were in force across the event, Europlacer succeeded in attracting many visitors to its stand and secured good quality leads as a result. “Visitors were very interested in our company and in our products,” reports Michael Xing, Europlacer’s Private Business Sector General Manager in China. “Notably, they were impressed with the style of our machines and particularly with our legendary flexibility and the intuitive graphics-driven operator interface. Included among our visitors were important customers linked to ongoing projects.”

Xing and his team used the Nepcon event to showcase one of Europlacer’s new pick & place modules machines for the first time in public. The ultra-flexible ii-A1 and high-speed ii-A2 were only launched earlier this year and complete Europlacer’s award-winning atom platform line-up to balance surface mount assembly lines and drive productivity. The ii-A2 machine was on the stand demonstrating its 50,000cph chipshooter credentials that are ideal for the high-speed volume manufacturing market in China, supported by an iineo+ machine, Europlacer’s most popular placement platform in high-mix assembly applications.

“I am thrilled with the way Nepcon Shenzhen has allowed us to present the unique capabilities of Europlacer equipment and our exceptional customer support infrastructure,” says Xing. “I look forward to next year’s event.”

Share

Print


Suggested Items

Understanding the Benefits of CFX

11/30/2018 | Stephen Las Marias, I-Connect007
In an interview with SMT007 Magazine, David Fenton, group customer support manager for Blakell Europlacer, discusses the technical challenges and the impact of the IPC Connected Factory Exchange (CFX) initiative on the PCB assembly industry, and what manufacturers can expect from this electronics assembly connectivity standard.

CFX: The Next Step Toward the Future of Factories

05/07/2018 | Stephen Las Marias, I-Connect007
For the past two to three years, almost every exhibitor in almost every trade show focused on the electronics manufacturing industry has an "Industry 4.0 Compatible" sign in their booth. As of today, the best question to ask is, "Compatible with what?" There has really been no standard yet developed toward this goal, and Industry 4.0 has been just a buzz word.



Copyright © 2021 I-Connect007. All rights reserved.