Yamaha Announces Distribution Agreement with Micropak

Reading time ( words)

Islamabad-based Micropak is an experienced supplier of surface-mount assembly automation, serving Pakistan’s growing electronics industry that includes OEMs and manufacturing services providers.

“The Yamaha brand increases our ability to deliver technically advanced and highly productive manufacturing solutions,” said Mr. Shahid Khan, Managing Director of Micropak. “We are looking forward to building our connection with Yamaha to maximise support for our clients and deliver high sales performance.” 

“Micropak is equipped to help us grow our presence in Pakistan, with excellent technical and commercial skills and a trusted reputation in the marketplace,” commented Yasushi Miyake, Branch Manager of Yamaha Motor Europe IM business. “We are looking forward to an inspiring partnership that will deliver great results for our two companies and the Pakistan high-tech sector.”

The distribution agreement with Micropak brings our One Stop Smart Solution to Pakistan, which tightly integrates inline SMT equipment, connected component storage, and factory-software tools to maximise productivity and efficiency. The complete Yamaha equipment portfolio includes YST intelligent storage towers, YCP compact printers and YSP highly automated printers, YRM, YSM and Sigma high-speed mounters with flexible options such as smart feeders and component-tray handling, the high-speed, high-resolution YSi-V 3D AOI system, YSi-SP solder-paste inspection, and 3D hybrid mounters.

04/26/2023 | I-Connect007

In this episode, Koh Young topic expert Ivan Aduna examines how closed-loop communication can make all the difference when it comes to inspection and achieving zero defects in your production line. Ivan also explores the importance of equipment suppliers working together to create M2M connections that allow for real-time exchange of SPI and AOI measurement data between machines—all in under four minutes.

11/19/2014 |

The implementation of surface-mount devices is crucial for smartphone manufacturers, offering increased component density and improved performance. Mobile products generally use an epoxy underfill to adhere components to the PCB to meet the mechanical strength requirements of a drop test. Reworking glued components is the most difficult application in the electronics industry, and must be addressed as a process.

10/15/2014 | Scott Zerkle, Yamaha Motor IM America Inc.

Today's robots can solve many manufacturing issues and are more cost effective than the ongoing costs of human labor. The purchase of a robot is a three- to five-year payoff, after which the expense is reduced to maintenance and utilities. A robot that matches the cycle time of the manual operation will most certainly surpass a human in efficiency over time.