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I-Connect007 Releases Segment 7 of Koh Young Webinar Series: ‘Converting Process Data Into Intelligence’
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
At just over seven minutes, the seventh episode, “Advanced Process Control and Inspection” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to... SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
Viewers of this episode will learn that, beyond the known benefits of printers communicating with solder paste inspection machines, connecting mounters with AOI delivers obvious benefits such as improved yields, especially in high density boards. The mounters use the received data to update the placement program, thereby ensuring the components are placed onto the solder deposits rather than onto the substrate pads. This approach uses the self-alignment principle to increase production yields and reduce defects.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes
Visit Converting Process Data Into Intelligence and start watching, free, today!