-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
I-Connect007 Releases Segment 7 of Koh Young Webinar Series: Advanced Process Control and Inspection
November 9, 2021 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Watch & Learn!
I-Connect007 Releases Segment 7 of Koh Young Webinar Series: ‘Converting Process Data Into Intelligence’
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success.
At just over seven minutes, the seventh episode, “Advanced Process Control and Inspection” is now available to view.
Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to... SMT Inspection, Today, Tomorrow and Beyond, presenters Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspection process.
Viewers of this episode will learn that, beyond the known benefits of printers communicating with solder paste inspection machines, connecting mounters with AOI delivers obvious benefits such as improved yields, especially in high density boards. The mounters use the received data to update the placement program, thereby ensuring the components are placed onto the solder deposits rather than onto the substrate pads. This approach uses the self-alignment principle to increase production yields and reduce defects.
This entire webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes
Visit Converting Process Data Into Intelligence and start watching, free, today!