-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
PVA Receives Patent Optical Bonding Software in Korea
November 23, 2021 | PVAEstimated reading time: 1 minute
PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it has patented its optical bonding software in Korea. With the new patent, the software is patented throughout the US, United Kingdom, France, Italy, Germany, Hungary, Portugal and Spain, and now Korea.
PVA's focus on these types of software and hardware tools demonstrate the company’s commitment to developing technology to reduce setup times and take the guesswork out of process and application development for the growing display bonding market. This software feature combined with PVA’s Fluid Flow Vision enables the rapid setup of a critical assembly step for new bonding processes.
The optical bonding software greatly simplifies the bonding process by providing a system that alleviates the guess-work of creating perfect bond sequences from scratch, resulting in less waste and faster time to production.
One of the most crucial and challenging steps in the optical bonding process is the final physical mating of the two substrates (e.g. glass to screen). With this patented feature, the user is able to have complete control over the sequence of events (speeds, distances, dwells, etc.) during this critical bonding step on an actual part in production. Using a single button and visual feedback on-screen, the user easily creates a live bond sequence while the machine is simultaneously learning and recording everything quietly in the background.
After the bond sequence has been completed, control is automatically handed back over to the machine to finish the rest of the bonding process. This “learned” bond sequence is then safely stored and can be easily recalled or modified for even more precise tuning.
Within the countless factors that go into making a perfect bond, this sequence must be highly controlled and finely tuned in order to not cause material leakage, trapped bubbles, or other defects that would result in a bad part. Leveraging this new functionality, users can now rapidly prototype and make production ready bond sequences with ease, providing speed and consistency to a once slow and complicated step in the optical bonding process.
PVA manufactures turnkey solutions that help its customers improve their competitiveness. This is accomplished through engineering robust processes that introduce repeatable results that reduce waste, increase throughput and lower manufacturing costs.
Suggested Items
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
The Connection Between Wire Harness and Box Build
04/17/2024 | Nolan Johnson, I-Connect007Christina Rutherford is a technical lead and expert in materials engineering at Honeywell, where her specialty is the design, specification, and manufacture of cables and wire harnesses. Rutherford also sits on the committee for IPC/WHMA-A-620. In this conversation, we explore the changing dynamics in wire harnesses and how they relate to box build. Christina’s standards work allows her to draw insightful parallels between wire harness and box build.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Connect the Dots: Designing for Reality: Prioritizing Manufacturability
04/11/2024 | Matt Stevenson -- Column: Connect the DotsRealistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. To do so, one must account for the production variables associated with individual manufacturing partners. Understanding and creating robust PCB designs, especially in terms of board manufacturing, requires a lot of attention to detail. When more detail is included in the design, the manufacturing process goes more smoothly, and process yields are higher.