Now Playing: ‘Predicting Reliability in Electronics’ Presented by the Experts at GEN3


Reading time ( words)

Webinar-Gen3-700x500.jpgWatch & Learn!  Predicting Reliability in Electronics Part 2: “Electrochemical Reliability and SIR.”

In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electro-chemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.  

The second episode, “Electrochemical Reliability and SIR,” can be viewed in under 15 minutes. Presenters share information on research conducted by NPL as a pan-European project, provide an explanation of ECM as corrosion, discuss the meaning of Objective Evidence, and more.  

Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive or general industrial applications.  

Visit Predicting Reliability in Electronics and start watching, free, today! 

Share




Suggested Items

Working on the Hill to Build a Future

11/08/2022 | Nolan Johnson, I-Connect007
The message can’t be emphasized enough: Producing IC substrates overseas weakens America’s position and national security. In this frank discussion with Will Marsh, president of PCBAA, he talks about his efforts to educate government policymakers on the dire need to consider the entire microelectronics ecosystem. There’s power in numbers, Will says, and he sees the association’s efforts making a difference.

Advanced Packaging Gets an Additive Upgrade

11/08/2022 | Art Wall, NextFlex
The recent approval of the CHIPS Act has reignited the U.S. semiconductor industry and shone a spotlight on the intricacies involved in chip manufacturing. As new technological innovations—such as 5G, IoT, AI, automotive and high-performance computing—come to market, they’re pushing chip manufacturing and integration capabilities. They demand more performance which leads to added complexity in an already extremely complicated process. All this requires a fundamental shift in the way that semiconductors are manufactured and integrated.

Four Silver Linings in the Stormy Clouds of Pandemic, Supply Chain, and Inflation

09/14/2022 | Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.