CyberOptics to Discuss 3D Inspection for Advanced Packaging at SEMICON Taiwan


Reading time ( words)

CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan December 1-3, 2021. The company will also exhibit in WaferSense® and ReticleSense® sensors and feature the WX3000™ Metrology and Inspection system in booths I3128, L0310, J2434 and K2106 at TaiNEX 1, Taipei, December 28-30, 2021.

Dr. Charlie Zhu, Director of Engineering at CyberOptics, will present ‘3D Inspection Is Becoming Essential in Advanced Packaging’ in the AP technical track on December 2nd at 3:30 p.m. local time.

Advanced Packaging continues to be among the most dynamic and rapidly evolving areas of semiconductor development and manufacturing. Most of these new processes take advantage of the third dimension, going vertical to continue packing more computing power into less space while circumventing the difficulties posed by further reductions in two-dimensional size.

As the processes and features they create have become smaller and more complex, manufacturers face an increasing need for high-precision inspection and measurement to detect defects and improve process control. As a result, the traditional 2D-based inspections can no longer satisfy the needs for quality control where 3D inspection is becoming essential. A growing number of applications in the AP process are requiring full 3D inspection instead of sampling and the trend is expected to continue. However, the traditional 3D inspection systems are either slow or inaccurate which means they are unable to meet the growing demand of AP.

This presentation will elaborate on the needs and challenges of 3D inspection in various AP applications such as Wafer-Level Packaging (WLP), System-in-Package (SiP) and Substrate Inspection, and how CyberOptics’ disruptive Multi Reflection Suppression™(MRS™) sensor technology can improve yields, processes and quality.

At the show, the company will feature the WX3000™ Metrology and Inspection system powered by the 3 µm NanoResolution MRS sensor that provides sub-micrometer accuracy on features as small as 25µm. The system is specifically designed for wafer-level and advanced packaging applications. While retaining its ability to reject spurious multiple reflections, it adds the ability to capture and analyze specular reflections from shiny surfaces of solder balls, bumps and pillars, allowing highly accurate inspection and metrology of these critical packaging features. Fast, 100% 3D/2D inspection and metrology can be conducted with throughput greater than 25 wafers (300mm) per hour, 2-3X faster than alternative solutions.

For more information, visit www.cyberoptics.com.

Share

Print


Suggested Items

Driving Down Cost in the Supply Chain

04/08/2021 | Meghan Zou, EPOCH
Driving cost out of the supply chain goes beyond reduction of raw material cost. Though many of the manufacturers today concentrate on negotiation with their raw material supplier(s) the hidden cost of internal supply chain goes undetected. To address the cost of the entire supply chain we should not only look at direct material cost but also the cost of internal supply chain. At Epoch we looked at four areas in particular which include: planning/tracking, storage/delivery, inventory management, and supplier relationships.

5 Keys to Smart Process Success

01/28/2021 | Steve Williams, The Right Approach Consulting LLC
Smart factories require the core underlying processes to be connected and “talking” to generate the data necessary to make real-time process decisions, that is, the IIoT (Industrial Internet of Things). In a truly connected factory, an ongoing continuous dialog between machines, business processes, suppliers and customers is happening in the background. This dialog is not only interactive, but proactive, as a constant stream of real-time data is tweaking and adjusting processes to drive improvement. It also provides time-critical information on how processes are operating, supply chain pipeline, and delivery status updates—all based on data.

An EMS Perspective on Inventory Management

08/27/2020 | I-Connect007 Editorial Team
Foad Ghalili of Epoch International discusses the inventory management practices the company has in place between its two facilities in Fremont, California, and Dalian, China; and how upgrading to an electronic management system made maintaining a much larger inventory possible.



Copyright © 2021 I-Connect007. All rights reserved.