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Thermaltronics USA, Inc. is pleased to announce that LeeMAH Electronics has made the TMT-9000s the standard soldering iron at its Dallas, TX facility. Additionally, PCBASupplies.com is the vendor of choice for their source. Scott Fillebrown, Principal at Southwest Systems Technology, Inc. was the manufacturers’ representative.
LeeMAH Electronics is a global electronics manufacturing service company founded in 1971. The company offers manufacturing and test solutions to OEMs with high-mix and low-medium volume needs. LeeMAH utilizes the same processes and similar equipment and test sets in all of its locations to provide seamless migrations and hybrid solutions for its customers.
LeeMAH selected the TMT-9000S based on its safety and quality ratings including ISO 9000 & ISO 14000 and certifications in TuV, GS, NRTL and CE. Additional factors included price, ability to hold temperature settings and local stock through PCBASupplies.com.
Robert Smith, LeeMAH Plant Manager commented: “We are an AS9100 certified facility so we need a very accurate soldering station without spending a fortune. We found exactly that with Thermaltronics through PCBASupplies.com.”
The TMT-9000S is based on Curie Heat Technology which responds to the thermal demands of each solder joint by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. The soldering and rework station offers high thermal recovery and performance with dual switchable soldering ports.
This equipment is autonomously capable of collecting and utilizing data for production processing, which is one of the most important factors necessary to meet the requirements of Industry 4.0 standards.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”