CyberOptics to Deliver Technical Presentation at SEMICON Taiwan


Reading time ( words)

CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3. The company will also exhibit in WaferSense® and ReticleSense® sensors and feature the WX3000™ Metrology and Inspection system in booths I3128, L0310, J2434 and K2106 at TaiNEX 1, Taipei, Dec 28-30th.

Dr. Charlie Zhu, Director of Engineering at CyberOptics, will present ‘3D Inspection Is Becoming Essential in Advanced Packaging’ in the AP technical track on December 2nd at 3:30pm local time. 

Advanced Packaging continues to be among the most dynamic and rapidly evolving areas of semiconductor development and manufacturing. Most of these new processes take advantage of the third dimension, going vertical to continue packing more computing power into less space while circumventing the difficulties posed by further reductions in two-dimensional size.

As the processes and features they create have become smaller and more complex, manufacturers face an increasing need for high-precision inspection and measurement to detect defects and improve process control. As a result, the traditional 2D-based inspections can no longer satisfy the needs for quality control where 3D inspection is becoming essential. A growing number of applications in the AP process are requiring full 3D inspection instead of sampling and the trend is expected to continue. However, the traditional 3D inspection systems are either slow or inaccurate which means they are unable to meet the growing demand of AP.

This presentation will elaborate on the needs and challenges of 3D inspection in various AP applications such as Wafer-Level Packaging (WLP), System-in-Package (SiP) and Substrate Inspection, and how CyberOptics’ disruptive Multi Reflection Suppression™(MRS™) sensor technology can improve yields, processes and quality.

At the show, the company will feature the WX3000™ Metrology and Inspection system powered by the 3 µm NanoResolution MRS sensor that provides sub-micrometer accuracy on features as small as 25µm. The system is specifically designed for wafer-level and advanced packaging applications. While retaining its ability to reject spurious multiple reflections, it adds the ability to capture and analyze specular reflections from shiny surfaces of solder balls, bumps and pillars, allowing highly accurate inspection and metrology of these critical packaging features. Fast, 100% 3D/2D inspection and metrology can be conducted with throughput greater than 25 wafers (300mm) per hour, 2-3X faster than alternative solutions.

For more information, visit www.cyberoptics.com.

Share

Print


Suggested Items

ProMetrics: An Easy, Smart Solution

01/05/2022 | I-Connect007 Editorial Team
Rehm's Michael Hanke speaks about the product on process and the advantages of live process monitoring with ProMetrics, Rehm’s newest monitoring tool, which is brand new and unique in the market. Users say that it’s easy to use and, more importantly, that it provides the security in a system they are looking for.

SMTAI 2021: Rob DiMatteo Turns Up the Heat at BTU

12/15/2021 | Nolan Johnson, I-Connect007
At SMTA International 2021, Nolan Johnson spoke with Rob DiMatteo of BTU International about the current shift in market drivers, pain points from customers, and what he expects to see in the near future. Chip shortages and port delays are just two of the challenges facing BTU’s customers. As general manager of BTU, DiMatteo wants his company to excel at customer service despite these challenges. He also previews a new flux management technology for keeping reflow ovens extremely clean, calling it a significant breakthrough.

Driving Down Cost in the Supply Chain

04/08/2021 | Meghan Zou, EPOCH
Driving cost out of the supply chain goes beyond reduction of raw material cost. Though many of the manufacturers today concentrate on negotiation with their raw material supplier(s) the hidden cost of internal supply chain goes undetected. To address the cost of the entire supply chain we should not only look at direct material cost but also the cost of internal supply chain. At Epoch we looked at four areas in particular which include: planning/tracking, storage/delivery, inventory management, and supplier relationships.



Copyright © 2022 I-Connect007. All rights reserved.