Reading time ( words)
Indium Corporation announces that it is now offering CW-305, a uniquely formulated flux-cored wire that offers superior ease of cleaning in which the post-soldering residue can be removed by using only a warm water-wash.
Indium Corporation’s halogen-free CW-305 cleans so well that residue removal can be delayed for up to 48 hours without affecting ionic cleanliness or visual circuit board appearance. CW-305 is beneficial for electrical hand soldering applications where high flux strength and the ability to clean with water are required, such as touch-up and rework applications for medical, aerospace, and automotive industries. CW-305 is also capable of soldering to heavily tarnished surfaces.
CW-305 is compatible with Indium Corporation’s suite of proven halogen-free, water-wash solder paste and wave fluxes as well as its halogen-containing water-wash fluxes. It is designed for both manual and automated touch-up and component addition.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
I-Connect007 Editorial Team
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”