Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open


Reading time ( words)

The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.

The technical sessions on Tuesday and Wednesday are organized into three tracks: Wafer-Level Packaging (WLP), 3D Packaging, and Advanced Manufacturing and Test (AMT). The WLP track features sessions on materials, reliability, metrology, processing, and new technology, such as Fan-Out WLP. The 3D Packaging track features sessions on design, test, characterization, wafer bonding, chip stacking, and processing for fan-out. The AMT track features sessions on process materials, equipment, inspection, and more.

Packaging technology experts Joe Dickson, WUS PCB Ltd; Tanja Braun, Ph.D., and Michael Topper, Fraunhofer IZM; John Lau, Ph.D., Unimicron; and Jeff Gotro, Ph.D., InnoCentrix, LLC, are scheduled to lead half-day Professional Development Courses on February 17, 2022.

Share

Print


Suggested Items

Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1

04/08/2021 | Brent Fischthal, Koh Young America
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.

Real Time with...IPC APEX EXPO 2021: Optimizing Pin Inspection In Automotive With True3D Tech

03/09/2021 | Real Time with...IPC
Guest Editor Michael Ford and Gustavo Jimenez, Koh Young's sales manager for Northern Mexico, discuss some of the company's newest technologies, including True3D™ technology for pin inspection, which has proven popular with the automotive segment.

Real Time with… IPC APEX EXPO 2021: Developments in Digital Manufacturing

03/08/2021 | Real Time with...IPC
Michael Ford and Pete Starkey discuss the industry trend towards digital manufacturing, the latest in 3D CAD technology, ontological data and the benefits of the new IPC standard for digital twins.



Copyright © 2022 I-Connect007. All rights reserved.