Indium Corporation Products ‘Live@APEX’


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Indium Corporation will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 25-27, San Diego, California, U.S.

Live@SMTAI is a collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, its industry partners, and, most importantly, the customers who get to experience the equipment and materials in a live-action environment.

This year’s program will highlight Indium Corporation materials, including:

  • Core 230-RC – flux-cored robotic soldering wire
  • CW-807 – electronics soldering cored wire
  • Durafuse™ LT – patent-pending low-temperature alloy system
  • FP-500 – no-clean flux pen
  • Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
  • Indium510L – solder paste designed for laser reflow
  • Indium12.8HF – jetting and microdispense solder paste
  • Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
  • TACFlux® 089 – no-clean flux formulated for SnAgCu and SnAg solders
  • TACFlux® 089HF – halogen-free, no-clean flux formulated for SnAgCu and SnAg solders

You can see these products at the following partner booths:

  • Apollo Seiko (booth #2141)
  • AIR-VAC Engineering (booth #1343)
  • Essemtec (booth #3040)
  • Finetech (booth #2100)
  • ITW EAE (booths #1433 and #1701)
  • JBC Tools (booth #2133)
  • Koh Young Technology (booths #1701 and #1717)
  • KYZEN (booth #2101)
  • Microcare (booth #909)
  • NSW Automation (booth #2417)
  • PARMI USA (booth #1108)
  • Pillarhouse International (booth #932)
  • Smart Sonic (booth #2522)
  • Trans-Tec America (booth #1932)
  • Universal Instruments Corporation (booth #2233)
  • VERMES Microdispensing (booth #2417)
  • ZESTRON Corporation (booth #1910)

By demonstrating Indium Corporation products on live equipment at the SMTAI show, attendees get an accurate and honest depiction of the material’s performance. If you see an Indium Corporation product running in a booth, be sure to Tweet and tag @IndiumCorp or use the hashtag #LiveatAPEX.

Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.

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