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The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design is the latest addition to I-Connect007’s comprehensive, educational library.
In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Signal integrity expert and professor Eric Bogatin says, “I’ve been in involved in aspects of PCB manufacturing and design for almost 40 years, and even I picked up a few useful nuggets of knowledge from this book.”
Nokia Principal Engineer Joe Smetana agrees: “This is an excellent primer for people who are doing high-speed PCB design. It connects the dots between signal integrity and manufacturing.”
Hundreds of eager readers have already downloaded this book. Get your free copy today at I-007ebooks.com. We hope you enjoy The Printed Circuit Designer’s Guide to Stackups: The Design within the Design.
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I-Connect007 Editorial Team
We recently spoke with Herb Snogren, an industry veteran and consultant with Summit Interconnect tasked with leading the company’s ultra HDI efforts. Herb is co-chair of the IPC ultra HDI subcommittee, IPC D-33-AP. In this interview, Herb discusses the current state of UHDI, how designers and fabricators can get started working in this new frontier, and why the U.S. must invest in UHDI technology now to counteract Asia’s near dominance of the UHDI segment, which has left some of our critical industries vulnerable to supply chain disruptions.
I-Connect007 Editorial Team
It makes a lot of sense: During times when the supply chain is stretched to the breaking point—and the last few years certainly qualify—what if PCB designers created boards that used fewer components and less laminate? Do PCBs still have to be 0.062" thick? Why not reduce layer count while they’re at it? Andy Shaughnessy and Nolan Johnson spoke with I-Connect007 columnist Dana Korf about the idea of designing a PCB with material conservation in mind. Is it a great new idea, or are we opening a whole new can of worms and a separate group of problems?
Heidi Barnes, Keysight Technologies
Electromagnetic (EM) solvers based on Maxwell’s equations have proven invaluable in the advancement of digital electronics and wireline communications. Plain and simple, electrical engineers need to know what a circuit or electrical interconnect will do when excited by a dynamic or varying signal. In the signal integrity world, an interconnect that passes a DC connectivity check can completely fail at higher frequencies. In the power integrity world, a power rail that measures the correct DC voltage could easily go into oscillation when a dynamic load is applied. Learning the basic skills to fire up an EM simulator, obtain qualitative answers in minutes, and higher fidelity answers in a few days, can be the difference between sleepless nights of product failures vs. robust designs with wide design margins.