-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Corporation to Feature High-Reliability Products for Power Electronics at APEC
February 24, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at APEC 2022, March 20-24, Houston, Texas, U.S.
Indium Corporation offers a robust portfolio of award-winning material solutions for power electronics, supported by its global manufacturing capabilities. These innovative products were developed in collaboration with key equipment partners to provide a solution for current and emerging industry challenges, including those required by automation. The products include:
InFORMS® reinforced solder alloy fabrications improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
Metal thermal interface materials (TIMs) are available for a wide variety of applications and process challenges. Indium Corporation’s Heat-Spring® TIM offers uniform thermal resistance with minimized surface resistance and increased heat flow.
Indium Corporation also offers solutions to ease other aspects of power module manufacturing. InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the need for fixturing during assembly for a lower cost of manufacturing ownership. InTACK™ is uniquely designed for clean flux-free reflow processes, maintaining high tack strength to hold materials in place without residues or the need for extra cleaning steps in the process.
For more information, visit Indium Corporation’s experts at the show at booth #1234.
Download The Printed Circuit Assembler’s Guide to… Solder Defectsby Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.