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Averatek is pleased to announce the addition of Jeff Berlin of TEC Associates to its marketing efforts. As a manufacturer's representative, Berlin will be responsible for business development with Mina, a surface treatment that enables soldering to aluminum. Replacing silver-based ACP (Anisotropic Conducting Paste) with solder, Mina offers more cost-effective and environmentally friendly manufacturing, with shorter processing times and reduced wet-chemistry steps.
“Mina™ lifts the constraints of traditional processes and opens a range of new applications – notably in the RFID, LED and automotive industries,” says Tara Dunn, Averatek Vice President of Marketing and Business Development “Helping business partners to realize the full benefits of this technology is a great fit for Jeff, with his years of industry experience.”
Soldering to aluminum traditionally requires an additional surface finish, such as Zincate and ENIG – or the use of conductive epoxy. These are cost-prohibitive and carry reliability challenges. Additionally, existing solders, fluxes and cleaners are formulated for copper-based PCBs and do not work well on aluminum.
“The culture of innovation at Averatek is energizing, and it is exciting to bring a breakthrough technology like Mina™ to the market,” says Jeff Berlin, TEC Associates Sales Representative. “Mina™ is a great addition to our line-up of quality products and a unique option for our customers.”
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.