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SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
The Halogen-free (ROL0) paste complies with RoHS, RoHS 2.0 and REACH, offering excellent voiding performance and good printability. PF918-P250 has a similar melting point to SAC305 so that the regular SAC305 reflow profile can be applied. With the innovative flux design, voiding easily can be controlled to less than 10 percent.
PF918-P250 can increase thermal reliability performance by a minimum of 30 percent. It provides better mechanical shock performance than typical solder alloys such as SAC305 and SAC405 and is suitable for use in consumer electronics, servers and automotive electronics applications.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
Nolan Johnson, I-Connect007
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The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.