Rehm Ensures Sustainable Condensation Soldering with the Closed-loop Principle and Active Galden Filtering


Reading time ( words)

Rehm ensures sustainable condensation soldering with the closed-loop principle and active Galden filtering – entirely in the spirit of the circular economy. 

In the social and political debate of recent years, the question of how to reduce the consumption of resources and how to recycle waste more sensibly has become much more relevant. One solution that has emerged from this is the concept of the circular economy, which can now be found in numerous national, regional and international strategies. The aim of the circular economy is to transform the previous linear economic system – which functions according to the take-make-waste flow principle – into a system focused on resource conservation, recycling and waste prevention.

With the closed-loop system for the injected medium Galden integrated in the vapour phase soldering systems of the Condenso series, Rehm has utilised a future-proof, sustainable solution right from the start.

The principle is equally efficient and resource-saving. After soldering, the vacuum and / or cooling process starts. At the same time, the process gas is extracted and purified. A vacuum is created during extraction – this guaranteeing rapid drying of the solder and process chamber and hence also minimising losses when the products are discharged.

The extracted Galden® is filtered and cleared of impurities using granules. Thus, about 99.9% of the medium can be recovered. The purified liquid is stored in a container at room temperature and made available for further processes. That means there are no evaporation losses and no energy losses. Due to the hermetic sealing of the process chamber (at the same time vacuum chamber), “evaporation loss” during soldering is also prevented. In addition to the minimum maintenance effort, the operating costs are also reduced by the lower medium consumption.

Greater reliability in the solder joint for durable products

The systems of the Condenso series can also be equipped with a vacuum process. This vacuum technology is used in a wide variety of processes. Oxidation is reduced in drying and bonding processes and the reliability of solder joints is increased in reflow soldering by reducing voids. Rejects are reduced, the life cycle of the end products is extended and ultimately a further contribution is made to the implementation of a sustainable circular economy in electronics manufacturing.

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.